The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2004
Filed:
Sep. 09, 1999
Applicant:
Inventors:
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/976 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/976 ;
Abstract
A semiconductor integrated circuit includes a semiconductor substrate , an insulating layer formed on the semiconductor substrate , and a bonding pad formed on the insulating layer . The semiconductor substrate has a region facing the bonding pad and a region substantially surrounding at least a part of the region . The region of the semiconductor substrate is set substantially at an equipotential.