The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2004
Filed:
Dec. 14, 2000
Applicant:
Inventors:
Tadahiro Okamoto, Kawasaki, JP;
Hirohisa Matsuki, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/1301 ; H01L 2/146 ; H01L 2/178 ; H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/1301 ; H01L 2/146 ; H01L 2/178 ; H01L 2/144 ;
Abstract
A plurality of chips divided from a semiconductor wafer having a plurality of semiconductor integrated circuits formed on a front surface of the wafer, are prepared, front surfaces of the chips being bonded to a first wafer sheet. The back and side surfaces of each chip bonded to the first wafer sheet are covered with a reinforcing thin film. Each of the plurality of chips is removed from the first wafer sheet. The flexural strength of a chip can be suppressed from being lowered by chipping and chip cracks.