The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2004
Filed:
Sep. 06, 2002
Applicant:
Inventors:
Tsuyoshi Honda, Gunma-ken, JP;
Toshio Shiobara, Gunma-ken, JP;
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J / ; C09J / ; C09J / ; C09J 8/02 ; H01L 2/329 ;
U.S. Cl.
CPC ...
C09J / ; C09J / ; C09J / ; C09J 8/02 ; H01L 2/329 ;
Abstract
A conductive resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) a conductive filler is provided wherein component (A) and/or (B) is a copolymer obtained by reacting an epoxy resin or phenolic resin with an organopolysiloxane, the organopolysiloxane component in the cured composition does not form a phase separation structure, and a weight ratio of (D) to (A) plus (B) is in the range: 300/100≦D/(A+B)≦1500/100. It possesses adhesion, heat resistance, moisture resistance, flexibility and impact resistance.