The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2004
Filed:
Sep. 20, 2001
Applicant:
Inventors:
Kimihiko Kajimoto, Kashihara, JP;
Junzou Wakuda, Kashihara, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 ;
U.S. Cl.
CPC ...
B24B 1/00 ;
Abstract
A method of manufacturing a silicon wafer including the step of flattening fine roughness existing on a side face of a silicon block or a silicon stack used for manufacturing the silicon wafer.
Quick Actions:
Kajimoto, Kimihiko. (2004). Method of manufacturing silicon wafer (U.S. Patent No. 6679759). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6679759
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile