The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2004
Filed:
Jun. 27, 2001
Yuji Abe, Kanagawa, JP;
Hiroshi Ishibashi, Kanagawa, JP;
Makoto Tsuji, Kanagawa, JP;
Hiroshi Yokoyama, Kanagawa, JP;
Toshiba Kikai Kabushiki Kaisha, Tokyo, JP;
Abstract
A die clamping apparatus including a movable plate which is in connection with a pushing-out pin which is projected from and retracted to a moving die and which is held movably with respect to a moving die plate, a clamp member for obtaining a constraint of the movable member, an air cylinder and a hook member. Only a movement of the movable member is constraint by the air cylinder with respect to the moving die plate when the latter is moved in a die opening direction from a die opening limit position, so that a resultant relative movement between the movable plate and the moving die plate, which causes the pushing-out pin to be projected from the moving die, resulting in a removal of a molded product, while the constraint of the movable member prevents the moving die plate from being moved in the die closing direction when the moving die plate in the die opening limit position is under non clamping condition.