The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2004

Filed:

Nov. 15, 2001
Applicant:
Inventors:

Yasuyoshi Serizawa, Shizuoka, JP;

Kenji Iwasaki, Shizuoka, JP;

Minoru Kubota, Shizuoka, JP;

Keizo Nishitani, Shizuoka, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/36 ; H05K 3/34 ; H01R 9/00 ;
U.S. Cl.
CPC ...
H05K 3/36 ; H05K 3/34 ; H01R 9/00 ;
Abstract

An upper surface of a bottom surface ( ) of a lower casing ( ), covering a lower surface of an FPC ( ), is made flat so as not to hinder a coating operation in which solder paste is coated to the upper surface of the FPC ( ) by a squeegee. This lower casing is made of a heat-resistant insulative material, and the lower casing is charged into a solder reflow furnace, with electronic parts ( ) attached to the FPC ( ).


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