The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2004

Filed:

Jun. 18, 2001
Applicant:
Inventor:

Hugo Santini, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/187 ;
U.S. Cl.
CPC ...
G11B 5/187 ;
Abstract

A magnetic transducer with a bilayer pole piece in which a first layer of material forms the body of the pole piece and a second layer forms the pole tip after milling is disclosed, along with a disk drive using the transducer. The bilayer pole piece is used in a method to improve the determination of the optimum stopping point for the ion milling using the optically observable process of the gap layer and P tip layer being milled off of the P protection layer forming a gradually disappearing halo. The process of making the head proceeds conventionally through plating of the P layer which in applicant's head is the layer which forms the body of P . The process of the invention deposits a P protection layer and then uses a photo lift-off technique to form a void in the P protection layer where the gap and the P and P tips will be formed, i.e., the zero throat region. An additional ferromagnetic layer (the “P tip layer”) is vacuum deposited in the void area to a thickness equal to the final desired pole tip height. The gap layer is deposited and the P tip is formed as in the prior art. Ion milling using the P tip as a mask is then performed as in the prior art with the exceptions: 1) that the P protection layer protects areas of the wafer which should not be milled; and 2) instead of milling a notch in the planar surface of P , only the excess of the P tip layer is required to be milled.


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