The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2004
Filed:
Jun. 12, 2002
Koichi Nagao, Kyoto, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A semiconductor device includes a lead frame having a die pad and leads, a first semiconductor chip having first internal electrodes and first external electrodes and mounted on the die pad, a second semiconductor chip having second internal electrodes and second external electrodes and bonded to the first semiconductor chip with the surfaces facing each other, the first internal electrodes being connected to the respective first internal electrodes with bumps, first and second metal fine wires connecting between the leads and the respective first and second external electrodes, and sealing resin. Both semiconductor chips are shifted from each other with the edges being substantially in parallel, a part of the end portion of each semiconductor chip protrudes from the edge of the counterpart semiconductor chip and the external electrodes are located in the protruded regions. Regardless of the outside dimension of both semiconductor chips, it is possible to electrically connect the semiconductor chip to the lead frame effectively.