The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2004

Filed:

Jun. 12, 2002
Applicant:
Inventors:

Kazushige Umetsu, Chino, JP;

Jun Amako, Shiojiri, JP;

Shinichi Yotsuya, Chino, JP;

Katsuji Arakawa, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract

A semiconductor chip having a vertical current conduction structure of a high reliability: a semiconductor device, a circuit substrate, and an electronic apparatus each containing such semiconductor chips; and a method for producing them. A prehole ( ) is formed in a silicon substrate ( ) surface-oriented to a (100) face by laser beam irradiation. The prehole ( ) is enlarged by anisotropic etching to thereby form a through-hole ( ). An electrically insulating film is formed on an inner wall of the through-hole ( ). An electrically conducting material is provided inside the insulating film to thereby form a metal bump ( ).


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