The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2004
Filed:
Dec. 24, 2001
Jakob Hermann, Dettenhausen, DE;
Eckehart Schulze, Weissach, DE;
Abstract
A device for integrally joining a metal block ( ′) that can consist of a number of plates, by hard-soldering or brazing. The hard-solder provides a connection covering a large surface and with a minimal thickness in solder gaps ( ; j=1, 2, . . . , n−1) located between adjacent segment plates ( ; i=1, 2, . . . , n). At least one capillary solder inflow path ( ) is provided. Said solder inflow path starts at a solder depot containing a supply of hard solder or braze material ( ), which melts as the stack ( ) of plates is heated. The melted solder material flows directly to the individual, also capillary solder gaps ( ; j=1, 2, . . . , n−1) via said solder inflow path, the solder gaps being provided between surfaces of the segment plates ( ) that face towards each other.