The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2004

Filed:

Dec. 21, 2001
Applicant:
Inventors:

Brandon T. Berg, West Lakeland, MN (US);

Tony B. Hollobaugh, Mauldin, SC (US);

David D. Nguyen, Savage, MN (US);

Bruce H. Koehler, Maplewood, MN (US);

Bruce A. Nerad, Oakdale, MN (US);

Assignee:

3M Innovative Properties Company, Saint Paul, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 4/324 ; B29C 5/904 ; B32B 3/100 ;
U.S. Cl.
CPC ...
B29C 4/324 ; B29C 5/904 ; B32B 3/100 ;
Abstract

Described is a method of indirect printing on a thermoplastic film having texture, wherein said method comprises: a) providing a heated thermoplastic melt; b) providing a tool having a molding portion that comprises a texture having a surface and a plurality of cavities in said surface, and that comprises a material having a surface energy sufficient to release ink; c) applying ink to said texture; d) substantially drying or curing said ink; e) contacting said thermoplastic melt with said molding portion having ink applied to it; f) forming a texture in said thermoplastic melt, wherein said texture comprises a plurality of protrusions and an area between said protrusions, that is the inverse of the texture of said molding surface; g) transferring said ink from said molding portion to said thermoplastic melt; h) quenching said thermoplastic melt to form a thermoplastic film; and i) removing said thermoplastic film from said molding portion.


Find Patent Forward Citations

Loading…