The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6676867 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 13, 2004

Filed:

Aug. 10, 2001
Applicant:
Inventors:

Atsushi Tsuchiya, Fukushima, JP;

Hirofumi Tateyama, Fukushima, JP;

Assignee:

Tohoku Munekata Co., LTD, Fukushimaken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/534 ; B29C 4/557 ;
U.S. Cl.
CPC ...
B29C 4/534 ; B29C 4/557 ;
Abstract

The present invention provides an injection molding method for providing a molded product with excellent transcription and an excellent gloss level. In this method, immediately after a resin is filled in a cavity ( ), a carbon dioxide gas is injected or the skin layer is moved back to form a space ( ) between the resin and the die surface ( ), so that growth of the skin layer is hold down, and at the same time the carbon dioxide is dissolved in the skin layer for lowering the glass transition point of skin layer. Then the skin layer is again closely cohered to a surface of the die by increasing the resin pressure and cooling the molded product for solidifying behind the holding pressure. With this method, products with excellent transcription and with an excellent surface gloss level can be obtained.


Find Patent Forward Citations

Tsuchiya, Atsushi. (2004). Resin and gas injection molding method with subsequent cohering (U.S. Patent No. 6676867). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6676867

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