The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2004
Filed:
May. 08, 2001
Michael B. Vincent, Chenango Forks, NY (US);
International Business Machines Corporation, Armonk, US;
Abstract
A method and structure for solderably coupling a semiconductor chip to a substrate, with an underfill between the chip and the substrate. In forming the structure, underfill material is dispensed upon a conductive pad on the substrate. The underfill material comprises a resin and a filler. The filler density is less than the resin density. The chip is moved toward the substrate and into the underfill until a solder member coupled to the chip is proximate the conductive pad. The structure is heated, resulting in soldering the solder member to the conductive pad and in curing the underfill. Filler particles move through the resin and toward the chip, resulting in an increased filler concentration near the solder member, and a reduced underfill coefficient of thermal expansion (CTE) near the solder member that is close to the CTE of the solder member.