The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2004

Filed:

Jun. 07, 2002
Applicant:
Inventors:

Takehiko Shimomura, Tokyo, JP;

Katsuyoshi Watanabe, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3552 ; H01R 9/00 ;
U.S. Cl.
CPC ...
H01L 2/3552 ; H01R 9/00 ;
Abstract

A semiconductor device has: an inner active region including a first electronic circuit formed on a semiconductor substrate; an outer active region positioned between the edges of the semiconductor substrate and the inner active region and including a second electronic circuit formed on the semiconductor substrate a main bonding pad for assembly formed inside a region where the inner active region is opposed to the outer active region and formed along the outer periphery of the inner active region a sub-bonding pad for analysis formed outside the opposing region where the inner active region is opposed to the outer active region and a pad-to-pad interconnection wiring for connecting the main bonding pad to the sub-bonding pad


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