The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2004
Filed:
Nov. 13, 2001
Hiroshi Hayami, Osaka, JP;
Shinya Nishikawa, Osaka, JP;
Sumitomo Electric Fine Polymer, Inc., Osaka, JP;
Abstract
A heat-resistant engineering-plastic composition that satisfies a soldering-heat resistance of 260° C. for 10 to 60 secs., that is less costly, that is free of problems in injection molding process, and that is excellent in heat-aging resistance. A heat-resistant molded product made with the heat-resistant engineering-plastic composition, such as a connector mounted on printed circuit board. The heat-resistant molded product is produced by (a) melt-kneading (a1) an engineering plastic either having or introduced an active site for reacting with a specific functional group and (a2) either an organic compound that has both the said specific functional group and a polymerizing functional group in the same molecule or polyolefin that has the said specific functional group described in (a1) to obtain a resin composition, (b) melt-molding the resin composition comprising of (a), and (c) irradiating the melt-molded resin composition with ionizing radiation.