The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2004
Filed:
May. 23, 2002
Fujio Ito, Hanno, JP;
Hiroaki Tanaka, Kodaira, JP;
Hiromichi Suzuki, Tachikawa, JP;
Tokuji Toida, Hamura, JP;
Takafumi Konno, Hakodate, JP;
Kunihiro Tsubosaki, Hino, JP;
Shigeki Tanaka, Hakodate, JP;
Kazunari Suzuki, Tokyo, JP;
Akihiko Kameoka, Ogose-machi, JP;
Other;
Abstract
In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the thickness. The inner leads are secured to the heat radiation plate. Fastening the inner leads to the heat radiation plate supports the latter and eliminates the need for suspending leads. A lead pitch p, the lead width w and lead thickness t of the inner lead tips connected to the semiconductor chip have the relations of w<t and p≦1.2t, with the inner leads secured to the heat radiation plate. The heat radiation plate has slits made therein to form radially shaped heat propagation paths between a semiconductor chip mounting area and the inner leads. In a molding member-sealed semiconductor device wherein the semiconductor chip is fixed to the heat radiation plate, the tip thickness t′ of the inner leads is made less than the thickness t of the other portions of the inner leads secured to the heat radiation plate.