The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2004
Filed:
Apr. 30, 2001
Michael Vogtmann, Pleasanton, CA (US);
Krishna Vepa, Livermore, CA (US);
Michael Wisnieski, Pleasanton, CA (US);
Wafer Solutions, Inc., Fremont, CA (US);
Abstract
The present invention provides exemplary methods, systems and apparatus that provide improved substrate characteristics after grinding operations by avoiding or reducing overgrind damage to the wafers. In one embodiment, a grinding apparatus ( ) includes a first spindle ( ) having an eccentric-shaped abrasive matrix ( ) coupled thereto and a second spindle ( ) adapted to hold a substrate ( ) to be ground. The second spindle is offset from said first spindle such that the abrasive matrix passes through the substrate surface center ( ) for only a portion of the time during grinding operations.