The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2004
Filed:
Mar. 13, 2001
Matsushita Electric Works, Ltd., Osaka, JP;
Abstract
A multilayer printed wiring board is formed with a plurality of conductor layers laminated as a whole with insulating layers interposed, a non-penetrating via hole provided in the insulating layer as bottomed by the conductor layer exposed, a plated layer provided inside the via hole for electric connection between the conductor layers, the via hole being formed to be of a concave curved surface of a radius in a range of 20 to 100 &mgr;m in axially sectioned view at continuing zone of inner periphery to bottom surface of the via hole, whereby the equipotential surfaces occurring upon plating the plated layer are curved along the continuing zone to unify the density of current for rendering the plated layer uniform in the thickness without being thinned at the continuing zone.