The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2003

Filed:

Feb. 22, 2001
Applicant:
Inventor:

Ming-Tung Shen, Taipei, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract

An integrated circuit chip including a circuit board unit and a plurality of contact pads on a top surface of the unit. A die having a plurality of solder pads is positioned adjacent the circuit board unit with the solder pads wire-bonded to the contact pads. A lead frame having connecting leads is positioned on the circuit board unit with the leads connected to the solder pads via a conductive contact layer. A plastic layer encapsulates the circuit board unit and at least a portion with the lead frame.


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