The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6670445 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 30, 2003

Filed:

Apr. 01, 2002
Applicant:
Inventor:

Hiroyuki Okuhira, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 6/26 ;
U.S. Cl.
CPC ...
C08F 6/26 ;
Abstract

Disclosed are a curable resin composition, which is liquid and therefore has good workability before curing and which can be softened or liquefied at a temperature lower than the thermal decomposition temperature in a short time after curing and a curable compound used in the composition as well as a method of easily disassembling a cured material. The curable compound has at least one thermally dissociable group (a) that does not participate in crosslinking reaction and at least two groups (b) participating in crosslinking reaction selected from the group consisting of an isocyanate group, a blocked isocyanate group, an alkoxysilyl group, an epoxy group, an acid anhydride group, an amino group, a latent amino group, a mercapto group and a carboxyl group.


Find Patent Forward Citations

Okuhira, Hiroyuki. (2003). Curable compounds, curable resin compositions containing the same and methods of easily disassembling cured materials (U.S. Patent No. 6670445). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6670445

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