The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2003
Filed:
Jan. 29, 2001
Mark A. Brodsky, Monte Sereno, CA (US);
JDS Uniphase Corporation, San Jose, CA (US);
Abstract
Laser beam or pulsed output is provided for enhancing the bonding strength between surfaces that are secured together, such as by lamination process or an adhesive, by texturing with a plurality of indentations formed in at least one of the surfaces to be bonded. As an example of this texturing, a fiber gain medium texturing system having a modulated pump or seed semiconductor laser source may be employed for forming a plurality of indentations in the surface of a die attachment pad of a semiconductor die or IC chip carrier. The indentations may be in the form of dimples or grooves. The indentations enhance the bonding strength formed between the chip and the die attachment pad using a die attaching adhesive. Also, the indentations in the die attachment pad provide a way for containment of rapidly expanding gases that formed in the chip carrier package when the package is subjected to high temperatures such as during a solder reflow operation.