The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2003

Filed:

Nov. 09, 2001
Applicant:
Inventors:

Hiromichi Tokuda, Omihachiman, JP;

Takashi Tomohiro, Omihachiman, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/126 ; H01L 2/144 ;
U.S. Cl.
CPC ...
B32B 3/126 ; H01L 2/144 ;
Abstract

In a method for manufacturing a laminated ceramic electronic component, a first transfer member and a second transfer member are prepared on a lamination stage to produce the laminated ceramic electronic component. The first transfer member includes a conductor-attached composite green sheet having a conductor on a portion of the surface thereof, including a non-magnetic ceramic region and a magnetic ceramic region, and a first carrier film that carries the conductor-attached composite green sheet. The second transfer member includes a ceramic green sheet and a carrier film that carries the ceramic green sheet. The laminated ceramic electronic component is thus produced through a first transfer step in which the ceramic green sheets are successively transferred, through a second transfer step in which the conductor-attached composite green sheet is transferred, and through a third transfer step in which the ceramic green sheet of the second transfer member is transferred. A desired conductor and a structure within a sintered ceramic body are produced with high accuracy, and the manufacturing process is greatly simplified, and costs of the laminated ceramic electronic component are greatly reduced.


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