The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2003

Filed:

Mar. 28, 2002
Applicant:
Inventors:

Howe Gripp, Kellinghusen, DE;

Paul Muller, Ostermiething, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 2/900 ; B24B 4/700 ;
U.S. Cl.
CPC ...
B24B 2/900 ; B24B 4/700 ;
Abstract

A chuck means for flat workpieces, in particular semi-conductor wafer for the chemical-mechanical polishing, comprising a circular housing which is attached to a driving spindle for rotation therewith and has a top wall and an annular side wall, a retaining ring which forms the lower part of the side wall, a chuck plate of rigid, however elastically deformable material which has an upper and a lower side and a plurality of openings at the lower side as well which openings are in connection with radial and axial parallel passages in the chuck plate, the passages being in fluid connection with an axial passage in the spindle, the axial passage being connected to a vacuum and/or fluid source, the chuck plate being floatingly and vertically movably located in the housing, a plurality of pressure chambers above the chuck plate, the pressure chambers having lower wall portions which are yieldable and engage the upper side of the chuck plate, pressure manifold means which are connected with a fluid source under pressure and control the pressure in the individual pressure chambers, the lower chamber walls being in frictional engagement with the chuck plate for the transfer of torque from the spindle to the chuck plate, whereby the polishing pressure of the chuck plate essentially is generated by the pressure in the pressure chambers.


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