The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2003

Filed:

Mar. 22, 2002
Applicant:
Inventors:

Akio Maeda, Kawasaki, JP;

Takashi Shiotani, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28B 1/02 ; B24B 7/19 ; B24B 7/30 ;
U.S. Cl.
CPC ...
B28B 1/02 ; B24B 7/19 ; B24B 7/30 ;
Abstract

A silicon base optical waveguide manufacturing method including the steps of preparing a silicon wafer having a plurality of embedded optical waveguides, performing first-stage dicing of the silicon wafer to form a cut groove by using a first resin diamond blade having a thickness t , and performing second-stage dicing of the silicon wafer along the cut groove to polish an end face of each optical waveguide by using a second resin diamond blade having a thickness t greater than the thickness t . The second resin diamond blade includes diamond abrasive grains having a grain diameter of 2 &mgr;m or less, and the relation between the thicknesses t and t is set to t +0.01 mm≦t ≦t +0.05 mm.


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