The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2003

Filed:

Dec. 11, 2002
Applicant:
Inventors:

Hidenori Ishihara, Hamamatsu, JP;

Hirokazu Tsuda, Toyohashi, JP;

Manabu Kato, Hamamatsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 7/00 ;
U.S. Cl.
CPC ...
G01L 7/00 ;
Abstract

According to a pressure sensitive sensor and a method of treating a terminal of a pressure sensitive sensor of the invention, a covering portion is formed by a thermoplastic resin material for hot melt molding or a photo-curing resin material cured by absorbing light energy. That is, molding pressure in molding is lower than molding pressure in molding by a general injection molding method. Therefore, a possibility of effecting adverse influence on respective connecting portions of an electrode line, a resistor, a conductive piece and a lead wire by the molding pressure is extremely low and disconnection caused by operating the molding pressure on the connecting portions can reliably be prevented.


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