The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2003
Filed:
Sep. 25, 1998
Boris Reynov, San Jose, CA (US);
Andreas Wenzel, Grenoble, FR;
Infineon Technologies North America Corp., San Jose, CA (US);
Abstract
The present invention relates to electronic packaging and a method for manufacturing the same. According to an embodiment of the present invention, an emulator chip package is designed and assembled such that a bottom portion of the emulator chip package is approximately the same electronic package used to package the target chip. Additionally, a top portion of the emulator chip package is approximately a slightly modified version of the same type of package used to package the target chip. According to an embodiment of the present invention, the top portion of the emulator chip package is attached to the bottom portion of the emulator chip package. The lead connector pins of the top portion of the package preferably leads up, while the connector pins of the bottom portion of the package preferably leads down.