The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2003

Filed:

Jun. 04, 2002
Applicant:
Inventors:

Yutaka Tsukada, Shiga-ken, JP;

Kimihiro Yamanaka, Shiga-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract

A ball grid array module is provided. In particular, the ball grid array module includes a substrate with two layers of insulation positioned thereon. At least one cavity having a side wall and a bottom wall is positioned in the first and second layers of insulation. The ball grid array module is adapted for having a solder ball positioned on the bottom wall of the cavity. During heating and reflow of the solder ball, positioning of the solder ball in the cavity prevents dislodging of the solder ball.


Find Patent Forward Citations

Tsukada, Yutaka. (2003). Ball grid array module and method of manufacturing same (U.S. Patent No. 6667559). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6667559

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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