The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2003

Filed:

Feb. 19, 2002
Applicant:
Inventor:

Hidehiko Nakata, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/306 ; H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/306 ; H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
Abstract

The invention relates to an installation technique for optical parts and electric parts. More particularly, it provides an installation structure and an installation method for optical modules that are applied to an optical communication field. The installation structure and the installation method can permit large tolerance of angular deviation in the provisional mounting, and can realize automatic positioning with high precision in the final mounting. The structure includes: a substrate on which a plurality of first metal pads are formed; a part to be mounted having second metal pads corresponding to the positions of the first metal pads; and solder bumps for connecting between the first and second metal pads to match the installation positions of these metal pads based on the surface tension of the solder bumps when the solder bumps are fused. In this structure, the substrate and/or the mounted part has at least two metal pads having larger areas than those of other metal pads, in the vicinity of the center of the substrate and/or the mounted part.


Find Patent Forward Citations

Loading…