The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2003

Filed:

Sep. 26, 2002
Applicant:
Inventors:

Brian W. Brollier, Cincinnati, OH (US);

John Pius Soehnlen, Loveland, OH (US);

Assignee:

International Paper Company, Tuxedo, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/28 ; B65D 8/500 ; G08B 1/324 ;
U.S. Cl.
CPC ...
B32B 3/28 ; B65D 8/500 ; G08B 1/324 ;
Abstract

A corrugated structure has a first and a second linerboard, with a corrugated medium sandwiched between the first and second linerboards. An RF processor is coupled between one of the linerboards and the corrugated medium. The processor may be positioned on an inlet or label, which may also include an antenna. A method of forming a corrugated structure having an embedded RFID processor includes providing a linerboard and a corrugated medium, positioning an RF processor between the linerboard and the corrugated medium, and affixing the linerboard and corrugated medium together with the RF processor positioned therebetween. An assembly line for forming a corrugated structure includes a supply of a first linerboard, a second linerboard, a corrugating material stock, and inlets that have an RF processor and antenna coupled to the inlets. The assembly line also includes a corrugator, a single facer, a double facer, an inlet applicator, and a cutter. The inlet applicator is for coupling the inlets to the corrugated medium.


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