The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2003

Filed:

Feb. 28, 2000
Applicant:
Inventor:

Hideki Asano, Kaisei-machi, JP;

Assignee:

Fuji Photo Film Co., Ltd., Kanagawa-Ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/00 ;
U.S. Cl.
CPC ...
H01S 5/00 ;
Abstract

A semiconductor laser device is bonded to a heat sink. The semiconductor laser device contains a stripe structure having a width equal to or greater than 10 micrometers, and including a first optical guide layer of a first conductivity type, an active layer, and a second optical guide layer of a second conductivity type. A total thickness of the first and second optical guide layers is equal to or more than 0.5 micrometers. The semiconductor laser device is soldered onto the heat sink at a surface of the semiconductor laser device where the surface located is farther from the active layer than other surfaces of the semiconductor laser device.


Find Patent Forward Citations

Asano, Hideki. (2003). Semiconductor laser unit having optical guide layers with increased total thickness and employing junction-up configuration (U.S. Patent No. 6665324). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6665324

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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