The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2003

Filed:

Dec. 26, 2001
Applicant:
Inventors:

Yoshifumi Takeyama, Kyoto, JP;

Ichiro Kataoka, Nara, JP;

Satoru Yamada, Nara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/701 ; H01L 2/712 ;
U.S. Cl.
CPC ...
H01L 2/701 ; H01L 2/712 ;
Abstract

A retaining substrate for mounting a semiconductor element thereon, having a circuit pattern for said semiconductor element, characterized in that said substrate comprises an insulative material, said substrate has a surface configuration having a cross section comprising (a) an uneven shaped portion and (b) a concave shaped portion which are arranged in tandem wherein a surface of said uneven shaped portion (a) makes a bottom face of said concave portion (b), and said uneven shaped portion (a) has a structure in that (a-i) an insulative convex shaped portion and (a-ii) an insulative concave shaped portion are alternately arranged so as to neighbor with each other, and said circuit pattern is provided in said concave shaped portion (a-ii) of said uneven shaped portion (a).


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