The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2003
Filed:
Apr. 27, 2001
Nobuo Tanabe, Tokyo, JP;
Kenichi Okada, Tokyo, JP;
Yukihiko Kurosawa, Tokyo, JP;
Takayuki Imai, Tokyo, JP;
Sadamitsu Jumonji, Tokyo, JP;
Masahiko Arai, Tokyo, JP;
Masahiro Kaizu, Sakura, JP;
Fujikura Ltd., Tokyo, JP;
Abstract
A flexible printed circuit board (FPC) comprises a base film; a base film side adhesive layer provided on the base film; a metal foil layer on which a pattern circuit is formed, provided on the base film side adhesive layer; and a cover layer side adhesive layer provided on the metal foil layer, wherein at least one of the base film side adhesive and the cover layer side adhesive layer has a higher glass transition temperature than an operating temperature of the flexible printed circuit board, so that the FPC has a stable flexibility at high temperature.