The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6664307 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 16, 2003

Filed:

Nov. 28, 2001
Applicant:
Inventors:

John R. Arnold, Burlington, CT (US);

Nicole M. Langer, Burlington, CT (US);

Assignee:

Dymax Corporation, Torrington, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 3/36 ;
U.S. Cl.
CPC ...
C08K 3/36 ;
Abstract

Low-shrinkage positioning formulations include, in addition to the resin-forming composition, a filler comprised of fibrous and spherical elements, usually of glass, present in a defined ratio and amount. The resin formulation may desirably comprise epoxy resin and a copolymerizable monomer having amide, acrylamide, or hydroxyl functionality, and may advantageously be devoid of any cationic catalyst ingredient.


Find Patent Forward Citations

Arnold, John. (2003). Low-shrinkage epoxy resin formulation (U.S. Patent No. 6664307). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6664307

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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