The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2003
Filed:
Jun. 07, 2001
Seiji Oka, Tokyo, JP;
Satoshi Yanaura, Tokyo, JP;
Yasuo Kawashima, Tokyo, JP;
Takeshi Muraki, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
In a method of manufacturing multi-layer printed wiring board, an uncured resin sheet is laminated on both surfaces of a printed wiring board having one or more layers, an organic cover film having a release property is laminated on the surfaces of the uncured resin sheets on upper and lower sides of the printed wiring board, a position of the printed wiring board is irradiated with a laser beam from the surface of the organic cover film to form a non-through hole that reaches a metal land for electrically conducting the layers of the inner printed wiring board, the non-through hole is filled with a thermosetting electrically conducting paste which is then half-cured, and the organic cover film is peeled off.