The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2003
Filed:
Jul. 16, 2001
Applicant:
Inventors:
Yoshiaki Hashimura, Hiratsuka, JP;
Ichiro Takasu, Hiratsuka, JP;
Assignee:
The Yokohama Rubber Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 3/030 ; B29D 3/036 ;
U.S. Cl.
CPC ...
B29D 3/030 ; B29D 3/036 ;
Abstract
A method of inflation able to prevent peeling of an inner layer in a process of molding accompanied with inflation and deformation, in particular, a method of molding a hollow composite by giving deformation toward an inner surface of at least one composite member so as to cause it to laminate with another composite member, comprising giving the deformation and performing the molding by a pressurizing and heating medium.