The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2003
Filed:
Dec. 19, 2001
Applicant:
Inventors:
Chinmay Suresh Betrabet, Corvallis, OR (US);
Davis Hoang Nhan, Greenville, WI (US);
Barton Andrew Laughlin, Hortonville, WI (US);
Daniel Hoo, Appleton, WI (US);
James Melvin Gaestel, Seymour, WI (US);
Assignee:
Kimberly-Clark Worldwide, Inc., Neenah, WI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/06 ; B23K 2/010 ; B23K 5/20 ; B08B 3/00 ;
U.S. Cl.
CPC ...
B23K 1/06 ; B23K 2/010 ; B23K 5/20 ; B08B 3/00 ;
Abstract
A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such that the fluid is applied is intermittently or continuously applied to at least a portion of the ultrasonic bonding surface.