The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2003

Filed:

Jan. 16, 2001
Applicant:
Inventors:

Satoshi Tanikawa, Shizuoka-ken, JP;

Takashi Ishii, Shizuoka-ken, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 4/300 ;
U.S. Cl.
CPC ...
H01R 4/300 ;
Abstract

In this method, a ground wire is overlaid on a shield wire in cross. Next, overlapping portions of the shield wire and the ground wire are interposed between an upper resin tip and a lower resin tip By executing a first ultrasonic oscillation while inserting a projection of an ultrasonic horn into a through hole of the tip outside rinds of the wires are removed in the vicinity of the overlapping portions. Next, by arranging a low-melting metal and a resin piece on a contact between the braided wire and the core line and executing a second ultrasonic oscillation, the contact can be brazed with the mutual welding of the tips


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