The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2003

Filed:

Nov. 17, 2000
Applicant:
Inventors:

David John Balter, Cuyahoga Falls, OH (US);

Michael Alois Kolowski, Mogodore, OH (US);

Anthony J. Scarpitti, Uniontown, OH (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 3/006 ;
U.S. Cl.
CPC ...
B29D 3/006 ;
Abstract

Method and apparatus for constrained post cure inflation (CPCI), for improvement of tire uniformity, footprint shape factor, and tread wear. The method comprises the steps of: (1) initiating the method on a tire after the tire has been removed from a tire curing mold (preferably while the tire is still hot); (2) providing 360 degree circumferential tread restraint which holds the tread in an ideal tread shape, concentric to the axis of rotation and nominally perpendicular to the equatorial plane; (3) sealingly holding the beads concentric to, and equidistant from, the axis of rotation, and symmetrically spaced about the equatorial plane; and (4) inflating the tire to a controlled pressure, and holding the controlled pressure for a controlled time while the tread is restrained and the beads are sealingly held. Optional additional steps include: before the inflating step, heating the tire, preferably to a controlled temperature above a glass transition temperature of the tire's ply cord material; and before the end of the controlled time, cooling the tire below the glass transition temperature. An apparatus (CPCI device) is disclosed which is suitable for implementing the inventive method.


Find Patent Forward Citations

Loading…