The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2003
Filed:
Jun. 13, 2001
Applicant:
Inventors:
Yasushi Yoshida, Yasu-gun, JP;
Tatsuo Kunishi, Takefu, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Primary Examiner:
Int. Cl.
CPC ...
C23C 1/840 ;
U.S. Cl.
CPC ...
C23C 1/840 ;
Abstract
An electroless copper plating bath containing a cupric compound, a cupric ion complexing agent, a reducing agent, and a pH adjusting agent is provided, in which a carboxylic acid is added as a reaction accelerator to accelerate the oxidation reaction of the reducing agent. It does not need to use formaldehyde as the reducing agent yet it has a plating reaction velocity which is equivalent to that of a bath in which formaldehyde is contained as the reducing agent.