The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2003
Filed:
Sep. 17, 2001
Sudhanshu Misra, Orlando, FL (US);
Pradip Kumar Roy, Orlando, FL (US);
Agere Systems, Inc., Allentown, PA (US);
Abstract
An improved polishing pad ( ) for use in a chemical mechanical polishing (CMP) operation as part of a semiconductor device fabrication process. The polishing pad is formed of a plurality of particles of abrasive material ( ) disposed in a matrix material ( ). The abrasive particles may be a stiff inorganic material coated with a coupling agent, and the matrix material may be a polymeric material such as polyurethane. As the polishing pad wears through repeated polishing operations, the newly exposed polishing surface will contain fresh abrasive particles and will exhibit the same polishing properties as the original surface, thereby providing consistent polishing performance throughout the life of the pad without the need for conditioning operations. In one embodiment the distribution of particles of abrasive material per unit volume of matrix material may vary from one portion ( ) of the pad to another ( ).