The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2003
Filed:
Jun. 11, 2002
Takayoshi Shioiri, Nagano, JP;
Takashi Terashima, Nagano, JP;
Eiki Iwashita, Nagano, JP;
Yoshitoshi Yamagiwa, Nagano, JP;
Nissei Plastic Industrial Co., Ltd., Nagano-ken, JP;
Abstract
Molding conditions of an injection molding machine are set through performance of virtual molding by CAE. First, actual molding is performed under provisional molding conditions in order to obtain an actual profile showing variation in load pressure actually measured during at least an injection step of the actual molding. Further, virtual molding is performed by CAE under the provisional molding conditions in order to obtain a virtual profile showing variation in load pressure simulated during at least an injection step of the virtual molding. The provisional molding conditions are changed by CAE in such a manner that the virtual profile coincides with the actual profile, to thereby obtain intermediate molding conditions. Subsequently, the intermediate molding conditions are optimized so as to obtain molding conditions for the injection molding machine.