The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2003

Filed:

Oct. 30, 2001
Applicant:
Inventors:

Masahiko Fujisawa, Tokyo, JP;

Kenichi Mori, Tokyo, JP;

Toshiaki Tsutsumi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/972 ;
U.S. Cl.
CPC ...
H01L 2/972 ;
Abstract

A semiconductor device includes metal silicide films formed on the surface of a source-drain region and of a gate electrode. On the metal silicide films, impurity regions are formed of a conductivity type opposite to the conductivity type of the source-drain region. This structure enables the contact resistance at the interfaces between contact layers and the metal silicide films even when the semiconductor integrated circuit is scaled down, thereby providing a high-speed semiconductor device and its manufacturing method.


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