The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2003

Filed:

Apr. 19, 2002
Applicant:
Inventors:

Wen-Shi Huang, Taoyuan, TW;

Kuo-Cheng Lin, Taoyuan, TW;

Chen-Chang Lin, Taipei, TW;

Assignee:

Delta Electronics Inc., Taoyuan Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F04D 2/960 ;
U.S. Cl.
CPC ...
F04D 2/960 ;
Abstract

A heat-dissipating assembly includes a plurality of heat-dissipating devices, each of which includes a frame having at least one locating window for allowing the heat-dissipating device to inhale air and discharge airflow, and a stream-guiding wall formed beside the locating window; and at least one blade structure mounted in the locating window of the frame. In addition, each heat-dissipating device further includes at least one engaging medium to be engaged with a corresponding engaging medium of another heat-dissipating device, thereby allowing the plurality of heat-dissipating devices to be combined in parallel, side by side, or in tiers.


Find Patent Forward Citations

Huang, Wen-Shi. (2003). Heat-dissipating assembly (U.S. Patent No. 6655908). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6655908

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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