The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2003
Filed:
Jun. 28, 2002
Applicant:
Inventors:
Kiyohiro Uchida, Tokyo, JP;
Keisuke Tsutsumi, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3482 ;
U.S. Cl.
CPC ...
H01L 2/3482 ;
Abstract
The semiconductor device has a backside electrode disposed on a backside of the semiconductor substrate and including multiple layers of metal. The backside electrode includes, on the semiconductor substrate, a first layer of aluminum, a second layer of barrier metal, a third layer of nickel, a fourth layer of silver and a fifth layer of gold which are disposed in this order.