The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2003
Filed:
May. 21, 2002
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A method and an apparatus for cutting a non-metallic substrate by a laser are disclosed. In the disclosed method and apparatus, a first laser beam for breaking molecular bonds of the non-metallic substrate material is scanned on a cutting path formed on the non-metallic substrate to form a scribe line having a crack in desired depth. Then, a second laser beam is scanned along a scanning path of the first laser beam to propagate the crack in a depth direction of the substrate and to completely separate the non-metallic substrate. Since the cutting speed can be controlled by the speed of the first laser beam, the cutting speed can be increased and the cutting speed can be easily controlled as compared with the conventional cutting method using the temperature difference due to the heating operation and the cooling operation.