The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2003
Filed:
Oct. 05, 2001
Richard A. Holl, Camarillo, CA (US);
Philip L. Lichtenberger, Thousand Oaks, CA (US);
Kenneth S. Yao, San Gabriel, CA (US);
Holl Technologies Company, Camarillo, CA (US);
Abstract
Highly filled composite materials, e.g. comprising approximately 60 volume % or greater of finely powdered particles of filler in a polymer matrix, are made by dissolving polymer in a volatilisable solvent, adding filler and forming a homogeneous mixture by high shear mixing. Most solvent is then removed while maintaining homogeneity in the mixture, preferably by evaporation in a high shear mill. Then, extruding a thin layer of the composite material and removing remaining solvent, as by heating. Bodies are formed from the dried layer, which are heated and pressed to melt and disperse melted polymer into the interstices between filler particles. Thereby, certain polymers unusable at low solids contents become effective bonding materials at high solids contents. Filler materials are chosen to tailor electrical and physical properties of the articles, which may comprise substrates for electronic circuits. Suitable polymers are certain polyarylene ethers soluble in cyclohexanone.