The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2003
Filed:
Jul. 27, 2001
Denso Corporation, Kariya, JP;
Abstract
A method of attaching a mold releasing agent to a molding die, a molding apparatus and a molding die therefor are disclosed. A fixed die ( ) of the molding die ( ) is connected to the nozzle receiving surface of a molding cavity ( ) facing a material supplying nozzle. The mold releasing agent is attached to the material contacting surface ( ) of the molding die ( ) in such a manner that the fixed die ( ) and a movable die ( ) are arranged in opposed relation to each other with a gap therebetween less than a distance which allows release of a molded product, and under this condition, the mold releasing agent is supplied to the material contacting surface ( ) through the gap between the material supplying nozzle ( ) and the nozzle receiving surface ( ).