The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2003
Filed:
Sep. 27, 2001
Applicant:
Inventors:
Yuichi Akanabe, Tokyo, JP;
Shozo Kikugawa, Tokyo, JP;
Tetsuo Okuno, Tokyo, JP;
Minoru Yamada, Tokyo, JP;
Assignee:
Konica Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/700 ; B23D 5/376 ; B05D 3/06 ;
U.S. Cl.
CPC ...
H04R 1/700 ; B23D 5/376 ; B05D 3/06 ;
Abstract
A processing method of electroless plating in which a catalyst layer is absorbed on a surface of a substrate, a laser beam is selectively applied to the catalyst layer, processing of electroless plating is applied to the substrate, thereby a plating layer is not formed on a part to which the laser beam has been applied, and a plating layer is formed on a part to which laser beam has not been applied.