The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2003

Filed:

Oct. 01, 2002
Applicant:
Inventors:

Stephen W. MacQuarrie, Vestal, NY (US);

Irving Memis, Vestal, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/144 ;
Abstract

In an integrated circuit package employing solder bump technology, a metal layer placed on the surface of a substrate below an array of bonding pads is split and displaced from its axis at selected locations to preserve electrical continuity, but to also lower the height of an insulating solder mask layer at those locations.


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