The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2003
Filed:
Feb. 26, 2002
Adam M. Kennedy, Santa Barbara, CA (US);
Michael Ray, Goleta, CA (US);
Richard H. Wyles, Santa Barbara, CA (US);
Jessica K. Wyles, Santa Barbara, CA (US);
William A. Radford, Santa Barbara, CA (US);
Raytheon Company, Lexington, MA (US);
Abstract
A focal plane array (FPA) of infrared (IR) radiation detectors ( ), such as an array of microbolometers, includes an active area ( A) containing a plurality of IR radiation detectors, a readout integrated circuit (ROIC) ( ) that is mechanically and electrically coupled to the active area and, disposed on the ROIC, a plurality of heater elements ( A) that are located and operated so as to provide a substantially uniform thermal distribution across at least the active area. The FPA further includes a plurality of temperature sensors ( B), individual ones of which are spatially associated with one of the heater elements for sensing the temperature in the vicinity of the associated heater element for providing closed loop operation of the associated heater element. In one embodiment pairs of the heater elements and associated temperature sensors are distributed in a substantially uniform manner across at least a top or a bottom surface of the ROIC, while in another embodiment pairs of the heater elements and associated temperature sensors, or only the heater elements, are distributed in accordance with a predetermined thermal profile of the FPA. The plurality of heater elements may each be composed of a silicon resistance, and the plurality of temperature sensors may each be each composed of a silicon temperature sensor.